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Global 300 mm wafer capacity data from SEMI
Semiconductor Equipment and Materials International said that global 300 mm wafer production capacity is estimated to reach 9.6 million units a month in 2026.
According to the organization, Samsung Electronics, SK Hynix, Intel, Micron Technology, Kioxia, TSMC, and UMC are planning to increase their plants by 82 for four years to come. It also said that this year’s growth is likely to be rather limited due to sluggish market demand.
China is increasing investment to boost its capacity. The organization said that China’s share in the market is estimated to rise from 22 percent to 25 percent from 2022 to 2026.
“In that period, South Korea’s market share is likely to fall from 25 percent to 23 percent due to sluggish memory chip demand,” it said, adding that those of Taiwan and Japan are forecast to decrease from 22 percent to 21 percent and from 13 percent to 12 percent, respectively.
“The analog and power chip market is expected to show an average annual growth of 30 percent and the estimate is 12 percent for foundry, 6 percent for optical semiconductor, and 4 percent for memory,” it explained.